Sango Logo
Semiconductor & High-Precision Electronics

Electronics Industry Manufacturing Solutions

Semiconductor wafer handling fixtures, vacuum chamber hardware, test socket pogo-pin blocks, and microelectronic thermal spreaders.

Sango provides ultra-precision machining and fabrication for the semiconductor front-end/back-end, PCB assembly, and electronics tooling sectors. Operating in clean environments with sub-micron jig grinding, cryogenic deburring, and ESD-safe polymer machining, we eliminate particulate contamination and thermal drift.

Quality Metrology
Stringent Quality Control Full CoC & Material Certs 100% Dimensional Inspection
Electronics Industry Manufacturing Solutions
Industry Compliance Certified
Traceable manufacturing records, CMM measurement reports, and material test certificates included with every production batch.
Machining Tolerance
±0.002 mm
Sub-micron optical alignment
Thermal Stability
Near-Zero CLTE
Invar 36 & Super Invar alloys
ESD Protection
10⁶ - 10⁹ Ω
Static-dissipative engineering plastics
Cleanliness
Vacuum Cleaned
Ultrasonic DI water & vacuum sealed
Strict Compliance

Quality Standards & Certifications

SEMI Standards

Semiconductor Equipment

Compliant with SEMI guidelines for wafer handling, outgassing, and material purity.

ESD S20.20

Electrostatic Discharge Control

Strict static control protocols for sensitive microelectronic assembly tooling.

ISO Class 7

Cleanroom Packaging

Particle-controlled cleaning and double-bagged cleanroom shipping.

Production Scope

Key Components & Manufacturing Solutions

From precision rapid prototypes to high-volume qualified assemblies.

Silicon Wafer Handling End-Effectors

Silicon Wafer Handling End-Effectors

Ultra-flat, static-dissipative vacuum chucks and robot transfer blades operating in high-temperature wafer processing chambers.

Processes:
Precision CNC MillingSurface LappingCryogenic Stress Relief
Materials:
CF-PEEK (ESD)Semiconductor CeramicHigh-Purity Quartz
IC Test Socket & Pogo Pin Contact Blocks

IC Test Socket & Pogo Pin Contact Blocks

Micro-drilled guide plates with thousands of micro-holes down to Ø 0.1mm on tight pitches for automated chip testing.

Processes:
Micro CNC DrillingJig GrindingOptical Verification
Materials:
Torlon 4203 / 5030Vespel SP-1Beryllium Copper
High-Power IGBT Liquid Cold Plates

High-Power IGBT Liquid Cold Plates

Micro-channel friction stir welded copper and aluminum cold plates for high-voltage power converters and data center servers.

Processes:
Micro-Channel MillingVacuum BrazingHelium Leak Check
Materials:
OFE Copper C101Aluminum 6063
Material Science

Recommended Industry Materials

01

Invar 36 (UNS K93600)

Near-zero coefficient of thermal expansion (CLTE < 1.5 ppm/K) preventing dimensional drift under extreme laser and lithography heat.

02

Torlon PAI & DuPont Vespel

Outstanding dimensional stability, high electrical resistivity, and wear resistance up to 300°C for semiconductor test sockets.

03

Oxygen-Free Electronic Copper (OFE C10100)

Highest thermal and electrical conductivity (101% IACS) for power semiconductor chill blocks.

04

ESD-Safe Plastics (Semitron / Delrin AF)

Controlled surface resistivity (10⁶ to 10⁹ ohms/sq) protecting sensitive microchips from electrostatic discharge.

Got Questions?

Industry Manufacturing FAQs

Accelerate Your Industry Program with Sango

Get instant manufacturability feedback, production quotes, and dedicated project management.

Consult with Industry Specialist